As foundation models evolve, AI technologies are reshaping the traditional logic of automobile manufacturing. From model adaptation to AI-driven full-vehicle ecosystems, the automotive industry is undergoing a fundamental shift—from mechanical to electronic, and now to software-defined architecture. Evaluation boards (EVBs) have become essential tools for automakers and Tier 1 suppliers to accelerate development.

To bridge smart connectivity and intelligent cockpit integration, MeiG Smart has built a range of EVB platforms based on its 5G intelligent cockpit modules and automotive-grade 5G communication modules. These platforms abstract complex hardware capabilities into readily accessible interfaces, significantly lowering the development threshold. Rich I/O ports, excellent performance, and a complete software ecosystem empower rapid prototyping and deployment for customers.

Plug-and-Play Intelligent Cockpit Framework: Enabling the Era of Cockpit-Connected Integration

MeiG Smart’s intelligent cockpit EVB adopts a modular design, supporting various cockpit modules including the SRM965. With versatile interfaces and a robust application ecosystem, the platform helps customers dramatically shorten integration and debugging cycles. Complete documentation and tutorials enable true plug-and-play usability.

For example, with the SRM965 module's powerful computing capabilities—200K DMIPS CPU, 48 TOPS AI, and 2.0 TFLOPS GPU—plus multiple camera and display interfaces, the EVB can drive several high-resolution screens simultaneously, such as instrument cluster, central control, co-pilot entertainment, and rear-seat displays, supporting differentiated content outputs (e.g., driver info on the cluster, media playback on the co-pilot screen). Its strong multi-camera access enables use cases like surround view (4-channel), front and rear vision, in-cabin driver monitoring (DMS), and occupant monitoring (OMS). Automakers can directly invoke prebuilt multi-camera calibration interfaces and display protocol stacks without developing low-level drivers, significantly shortening the development cycle for multimodal interaction.

What’s more, this EVB is designed for rapid function expansion without additional circuit design. A dedicated expansion board supports advanced features. For camera integration, four 60-pin ZIF connectors are reserved for rear, front, and SCAN peripherals. For display, three 60-pin ZIF connectors are available, including a USB 3.0–to–DP output. Each connector includes LCD control signals, 4-lane MIPI-DSI data, power, and I2C, enabling quick implementation of multi-display control, video fusion, and other complex functions.

5G + C-V2X Connectivity Base for Advanced Driving: Modular Expansion Accelerates Smart Driving Deployment

MeiG Smart’s intelligent connectivity EVB offers exceptional flexibility and connectivity, with multiple network and antenna interfaces, along with a rich set of software applications. This combination of standardized hardware interfaces and open-source software ecosystems empowers customers to focus on innovation, not infrastructure—accelerating the development and deployment of intelligent connectivity and advanced driver assistance systems (ADAS).

For instance, the EVB powered by MeiG’s MA925 module fully integrates 5G Release 16 and C-V2X direct communication (supporting up to 6,000 signature verifications per second). It also comes preloaded with V2X coordination algorithms and a dual-frequency GNSS engine, offering a robust foundation for cloud-controlled V2X applications. Developers can connect to cloud platforms and quickly validate V2X use cases—such as intersection collision warnings—by parsing RTSP video streams (e.g., traffic lights, nearby vehicle positions) using built-in algorithms, without the need for complex custom protocol stacks.

The platform also supports flexible upgrades—such as pairing with the SNM980 compute module for AI decision-making at the edge. Software-wise, the EVB is based on the Qualcomm Android baseline and includes a full BSP package supporting multi-display, multi-camera, T-Box, GNSS, RGMII/SGMII, and ADSP development, helping customers streamline selection, integration, and testing.

Transforming Module Capability into Competitive Advantage

At its core, MeiG Smart’s in-vehicle EVB platforms are designed to translate modular capabilities into customer competitiveness. Backed by a comprehensive automotive module portfolio—from the 48 TOPS computing power of SRM965 to the 5G R16 communication backbone of MA925—MeiG Smart empowers automakers and Tier 1 suppliers with pre-integrated hardware, configurable software, and an open ecosystem to chart their own intelligent automotive blueprint in both smart connectivity and cockpit integration.