Cooperative work and unified management of multiple networks
Small package, low cost, high reliability
Multiple payment methods free retailers’ hands
Blind spot diagnosis for safe driving with ease and efficiency
Cooperative work and unified management of multiple networks
Small package low cost high reliability
Multiple payment methods free the hands of the retailer
Blind spot diagnosis for safe driving with ease and efficiency
5G NR Sub-6GHz LGA Packaging
5G NR Sub-6GHz LGA Packaging
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5G NR Sub-6GHz M.2 Package
5G NR Sub-6GHz M.2 Package
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5G NR Sub-6GHz MiniPCIe Packaging Module
5G NR Sub-6GHz MiniPCIe Packaging Module
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5G NR M.2 Packaging Module
5G NR M.2 Packaging Module
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R&D teams
5G leads the smart era
Qualcomm + Hisilicon + UNISOC
Bachelor degree or above in
R&D teams
Annual investment in R&D
In 2020, “Cat.1” suddenly appeared and trended in the Internet of Things industry. With the accelerated withdrawal of 2G/3G, Cat.1 filled the market demand of low-and medium-speed Internet of Things users. Therefore, a lot of operators and chipset R&D and manufacturing enterprises work collectively to support the development of Cat.1.In March last year, MeiG Smart, as the world's leading supplier of cellular modules and IoT solutions, joined hands with UNISOC, the industry's leading manufacturer of cellular chips, to launch the new LTE Cat.1 series module, —SLM320, which has won several operator projects and awards from its partners since its release.
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