The SRM819W is a next-generation 5G-Advanced communication module built on the Qualcomm® X85 Modem-RF system. It complies with the latest 3GPP Release 18 standard and supports both 5G and sub-6 GHz networks, incorporating new frequency bands and combinations introduced in Release 18 to enable global 5G connectivity. The module supports 6CC in downlink with 1024QAM, achieving up to 400 MHz bandwidth and peak downlink speeds exceeding 12.5 Gbps. For uplink, it leverages advanced technologies such as UL 2CC and SUL (supplementary uplink), delivering up to 3.7 Gbps peak upload speed. The SRM819W is also equipped with 8-RX antenna reception and 29 dBm Power Class 1.5 transmit power, along with support for NB-IoT NTN satellite communications, ensuring stable, wide-coverage, high-quality connectivity across diverse environments.
The module have a rich set of high-speed interfaces , including three PCIe ports, two USXGMII interfaces, and USB 3.1, meeting the high-speed connectivity demands of various end devices and significantly accelerating 5G terminal development while reducing costs.
For Wi-Fi companion support, the SRM819W offers flexible Wi-Fi 7 configuration options such as dual-band 4×4 BE7200 and dual-band 2×2 BE3600, along with EasyMesh™ technology and the more secure WPA3 R3 encryption protocol, delivering secure and stable wireless network access for users.
Advantages:
Complies 3GPP Release 18 standard
5G mmWave、sub-6 GHz networks
Diverse edge AI processing capabilities
Up to 400 MHz bandwidth, with peak downlink speeds exceeding 12.5 Gbps
Supports UL 2CC, SUL and other advanced uplink technologies, delivering up to 3.7 Gbps peak upload speed
| Basic Attributes: | |
| Product number: | 5G M2M SRM819W |
| Package: | LGA |
| Size(mm): | 56.0mm x 53.0mm x 2.95mm |
| Certifications: | CE*/FCC* |
| Band Information: | |
| EA: | 5G NR mmWave:N257/258/259 5G Sub6G: FDD:N1/N3/N5/N7/N8/N20/N28/N71/N75/N76TDD:N38/N40/N41/N77/N78 LTE:FDD:B1/B3/B5/B7/B8/B20/B28/B32/B71TDD:B38/B40/B41/B42/B43 |
| EU: | 5G NR mmWave:N259/260/261 5G Sub6G: FDD:N2/N5/N7(30)/N12/N13/N14/N25/N26/N29/N66/N71 TDD:N38/N41/N48/N77/N78 LTE: TDD:B38/B41/B42/B43/B48 FDD:B2/B4/B5/B7(30)/B12/B13/B14/B17/B25/B26/B66/B71 |
| Module Interfaces: | |
| PCIe Gen3.0 x3 | |
| USB 3.1x1 | |
| USIMx2 | |
| USXGMIIx2 | |
| GNSSx1 | |
| Temperature and Humidity: | |
| Routine operating temperature: | -10°C to 55°C |
| Remark:* under development | |
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