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AI computing module SNM970

AI computing module SNM970

AI computing module SNM970

MeiG SNM970 series module is developed on the Qualcomm Snapdragon 800 series QCS8550(8 Gen 2) platform, which integrates Qualcomm 8-core Kryo™ CPU (1x Kryo Prime 3.2 GHz + 4x Kryo Gold 2.8 GHz + 3x Kryo Silver 2.0 GHz) with 4nm process. With Qualcomm Adreno™ DPU 1295, it supports 8K display resolutions. Qualcomm Adreno™ VPU 8550 supports 8K@30fps video encode/8K@60fps video decode, H.264/H.265. Qualcomm Adreno™ GPU 740, supports OpenGL ES 3.2, Vulkan1.2 and OpenCL 3.0. Integrated with Qualcomm neural network processing unit Qualcomm® Hexagon™ Tensor Processor, its computing power is up to 48 Tops.

SNM970 series module runs Android 13/Yocto Linux operating system and the default onboard storage is 256GB UFS + 16GB LPDDR5x. It supports WIFI 7 and BT5.3.

SNM970 series module integrates rich functional interfaces, including LCM, Display Port display interface, touch screen, camera*, PCIe interface, USB interface, I2C interface, UART interface, SPI interface, etc. Products can be widely used in video conference systems, VR Cameras, intelligent robots, video surveillance, security surveillance, intelligent information gathering equipment, live streaming terminals and other products.

Main Advantages:

● Qualcomm 8-core KryoTM processor with max core

● frequency of 3.2 GHz

● High AI computations~48 Tops

● Android 13/Yocto Linux

● Support dual/three screen display

● 3 groups of ISP,8 groups of 4-lane MIPI-CSI interfaces

● Support 1 USB 3.1 Gen2

● Support 8K@30fps video encode or 8K@60fps decode

● Support PCIe interfaces

● Long life cycle, up to 2030

Basic Attributes:
Product number:

Smart module with high computing power SNM970



OS:Android 13/Yocto Linux

256GB UFS + 16GB LPDDR5x (default)

128GB UFS + 16GB LPDDR5x (optional)

128GB UFS + 8GB LPDDR5x (optional)

Working temperature:-30°C ~ +75°C
Storage temperature:-40°C ~ +90°C

40.0 x 45.0 x 2.7mm

operating voltage:

3.5V~4.35V(typical value:3.8V)

Outstanding Features


BT: BT 5.3
3 x 4K screen display
USB 3.1
8 x camera interfaces
8K video en/decode capability
Antenna interface:
2 x Wi-Fi&BT antenna
Other interfaces:
PCIe interface:1 (2-lane Gen3)
I2C interface:3 x I2C_HUB0 +2 x SSC_QUP+1 x QUP+ 4
UART interface:3(3 support hardware flow control, the highest rate up to 4Mbps)
SD Card interface:1(support SD 3.0, 4-bit SDIO,dual-voltage)
SPI interface:5 (1 x sensor)
ADC interface:2
PWM interface:2
GPIO interface:≥35
USB interface
1 x USB 3.1 Gen2
Support USB OTG, one USB support DisplayPort v1.4
audio interface
Digital interface:

• Digital interface:

5 x IIS/TDM/PCM interface

Support Audio over USB Type-C

Touch screen interface
I2C interface capacitive touch screen
Camera Port*
• 8 x 4-lane MIPI-CSI*

• Qualcomm Spectra™ 680 ISP

(36 M + 36 M + 36 M) @ 30 fps - triple camera

(64 M + 36 M) @ 30 fps - dual camera

108 M @ 30 fps - single cameras

Interface information
Display Port

• 2 x 4-lane MIPI-DSI

3480 × 2160@120Hz or 3360 x 1600@144H

• 1 x DisplayPort v1.4 with MST

1 x 8k@30Hz or 2x 4K@60Hz

• VDC-M (DSC Mode)

Internal panel and DSC v1.2

Multimedia information
Video codec
Decode:4K@240fps or 8K@60fps H.264/H.265/VP9
Encode:4K@120fps or 8K@30fps H.264/H.265
Concurrency:4K@60 Decode + 4K@60 Encode
SNM970 Series frequency band information

WIFI 7, 2 × 2 MIMO

Remarks: * Under development.

Related downloads:

  • Product Specification

    MeiG High computility AI Module SNM970 Specification V2.0

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